The first generation of infrared imaging technology is mainly composed of infrared detectors, optical machine scanners, signal processing circuits and video displays. The infrared detector is the core device of the system, which determines the main performance of the system. Infrared detectors include devices such as indium antimonide (InSb) and mercury cadmium telluride (HgCdTe or CMT). At present, high-performance multi-component HgCdTe detectors are widely developed, and the number of components has reached as high as 60 yuan, 120 yuan and 180 yuan. In the early 1980s, a device called a SPRITE detector (or a sweeping detector) came out in the UK, which consisted of several narrow photoconductive HgCdTe elements with an aspect ratio greater than 10:1. Operates under positive bias. In addition to the signal detection function, the SPRITE detector can also realize the delay and integration of the signal inside the device, reducing the number of device leads and heat load. Compared with the multi-element detector, the Dewar bottle has a simple structure and reduced process difficulty, which greatly improves reliability. An 8-strip SPRITE detector is equivalent to the performance of a 120-element HgCdTe detector, but only needs 8 signal channels. In order to facilitate the organization of mass production, reduce the cost of thermal imaging cameras, save the cost of repeated design and development, facilitate repair, maintenance and effectively equip troops, the United States, Britain, France and other countries have implemented general componentization of thermal imaging. General components for thermal imaging in the United States use multiple HgCdTe detectors and a parallel scanning system; while the UK uses SPRITE detectors and a serial and parallel scanning system. The temperature resolution of these two thermal imaging systems can be less than 0.1°C, and the image clarity is comparable to that of image intensification technology.